May 16, 2017 Conference paper Open Access

Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny

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{
  "description": "<p>This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.</p>", 
  "license": "https://creativecommons.org/licenses/by-nc/4.0/legalcode", 
  "creator": [
    {
      "affiliation": "X-FAB MEMS Foundry GmbH", 
      "@type": "Person", 
      "name": "Dempwolf, Sophia"
    }, 
    {
      "affiliation": "Fraunhofer Institute for Electronic Nano Systems", 
      "@type": "Person", 
      "name": "Hofmann, Lutz"
    }, 
    {
      "affiliation": "X-Celeprint Inc.", 
      "@type": "Person", 
      "name": "Bowers, Christopher"
    }, 
    {
      "affiliation": "X-FAB MEMS Foundry GmbH", 
      "@type": "Person", 
      "name": "Guenther, Daniela"
    }, 
    {
      "affiliation": "X-FAB MEMS Foundry GmbH", 
      "@type": "Person", 
      "name": "Knechtel, Roy"
    }, 
    {
      "affiliation": "Fraunhofer Institute for Electronic Nano Systems", 
      "@type": "Person", 
      "name": "Schulz, Stefan E."
    }, 
    {
      "affiliation": "X-FAB MEMS Foundry GmbH", 
      "@type": "Person", 
      "name": "Gerbach, Ronny"
    }
  ], 
  "headline": "Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors", 
  "image": "https://zenodo.org/static/img/logos/zenodo-gradient-round.svg", 
  "datePublished": "2017-05-16", 
  "url": "https://zenodo.org/record/1043259", 
  "@type": "ScholarlyArticle", 
  "@context": "https://schema.org/", 
  "identifier": "https://doi.org/10.5281/zenodo.1043259", 
  "@id": "https://doi.org/10.5281/zenodo.1043259", 
  "workFeatured": {
    "location": "Tokyo, Japan", 
    "@type": "Event", 
    "name": "2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)"
  }, 
  "name": "Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors"
}