May 16, 2017 Conference paper Open Access

Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny

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{
  "files": [
    {
      "links": {
        "self": "https://zenodo.org/api/files/2720714c-fba6-4bfb-bf71-2c789d4f5ef3/20170407_LTB3D-2017_X-FAB.pdf"
      }, 
      "checksum": "md5:b191c88068a13ce5df66ba9bc7a0584f", 
      "bucket": "2720714c-fba6-4bfb-bf71-2c789d4f5ef3", 
      "key": "20170407_LTB3D-2017_X-FAB.pdf", 
      "type": "pdf", 
      "size": 187276
    }
  ], 
  "owners": [
    38124
  ], 
  "doi": "10.5281/zenodo.1043259", 
  "stats": {
    "version_unique_downloads": 218.0, 
    "unique_views": 186.0, 
    "views": 195.0, 
    "version_views": 194.0, 
    "unique_downloads": 217.0, 
    "version_unique_views": 185.0, 
    "volume": 42886204.0, 
    "version_downloads": 230.0, 
    "downloads": 229.0, 
    "version_volume": 43073480.0
  }, 
  "links": {
    "doi": "https://doi.org/10.5281/zenodo.1043259", 
    "conceptdoi": "https://doi.org/10.5281/zenodo.1043258", 
    "bucket": "https://zenodo.org/api/files/2720714c-fba6-4bfb-bf71-2c789d4f5ef3", 
    "conceptbadge": "https://zenodo.org/badge/doi/10.5281/zenodo.1043258.svg", 
    "html": "https://zenodo.org/record/1043259", 
    "latest_html": "https://zenodo.org/record/1043259", 
    "badge": "https://zenodo.org/badge/doi/10.5281/zenodo.1043259.svg", 
    "latest": "https://zenodo.org/api/records/1043259"
  }, 
  "conceptdoi": "10.5281/zenodo.1043258", 
  "created": "2018-05-29T10:13:37.171233+00:00", 
  "updated": "2020-01-20T16:47:32.828636+00:00", 
  "conceptrecid": "1043258", 
  "revision": 5, 
  "id": 1043259, 
  "metadata": {
    "access_right_category": "success", 
    "doi": "10.5281/zenodo.1043259", 
    "description": "<p>This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.</p>", 
    "license": {
      "id": "CC-BY-NC-4.0"
    }, 
    "title": "Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors", 
    "relations": {
      "version": [
        {
          "count": 1, 
          "index": 0, 
          "parent": {
            "pid_type": "recid", 
            "pid_value": "1043258"
          }, 
          "is_last": true, 
          "last_child": {
            "pid_type": "recid", 
            "pid_value": "1043259"
          }
        }
      ]
    }, 
    "grants": [
      {
        "code": "737465", 
        "links": {
          "self": "https://zenodo.org/api/grants/10.13039/501100000780::737465"
        }, 
        "title": "Pilot line for micro-transfer-printing of functional components on wafer level", 
        "acronym": "MICROPRINCE", 
        "program": "H2020", 
        "funder": {
          "doi": "10.13039/501100000780", 
          "acronyms": [], 
          "name": "European Commission", 
          "links": {
            "self": "https://zenodo.org/api/funders/10.13039/501100000780"
          }
        }
      }
    ], 
    "communities": [
      {
        "id": "microprince"
      }
    ], 
    "publication_date": "2017-05-16", 
    "creators": [
      {
        "affiliation": "X-FAB MEMS Foundry GmbH", 
        "name": "Dempwolf, Sophia"
      }, 
      {
        "affiliation": "Fraunhofer Institute for Electronic Nano Systems", 
        "name": "Hofmann, Lutz"
      }, 
      {
        "affiliation": "X-Celeprint Inc.", 
        "name": "Bowers, Christopher"
      }, 
      {
        "affiliation": "X-FAB MEMS Foundry GmbH", 
        "name": "Guenther, Daniela"
      }, 
      {
        "affiliation": "X-FAB MEMS Foundry GmbH", 
        "name": "Knechtel, Roy"
      }, 
      {
        "affiliation": "Fraunhofer Institute for Electronic Nano Systems", 
        "name": "Schulz, Stefan E."
      }, 
      {
        "affiliation": "X-FAB MEMS Foundry GmbH", 
        "name": "Gerbach, Ronny"
      }
    ], 
    "meeting": {
      "dates": "16 May - 18 May 2017", 
      "place": "Tokyo, Japan", 
      "title": "2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)"
    }, 
    "access_right": "open", 
    "resource_type": {
      "subtype": "conferencepaper", 
      "type": "publication", 
      "title": "Conference paper"
    }, 
    "related_identifiers": [
      {
        "scheme": "doi", 
        "identifier": "10.5281/zenodo.1043258", 
        "relation": "isVersionOf"
      }
    ]
  }
}