Conference paper Open Access

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny

GeoJSON Export

{
  "type": "FeatureCollection", 
  "features": []
}
194
230
views
downloads
All versions This version
Views 194195
Downloads 230229
Data volume 43.1 MB42.9 MB
Unique views 185186
Unique downloads 218217
More info on how stats are collected.
Indexed in
Publication date:
May 16, 2017
DOI:
10.5281/zenodo.1043259

Zenodo DOI Badge

DOI 

10.5281/zenodo.1043259

Markdown 

[![DOI](https://zenodo.org/badge/DOI/10.5281/zenodo.1043259.svg)](https://doi.org/10.5281/zenodo.1043259)

reStructedText 

.. image:: https://zenodo.org/badge/DOI/10.5281/zenodo.1043259.svg
   :target: https://doi.org/10.5281/zenodo.1043259

HTML 

<a href="https://doi.org/10.5281/zenodo.1043259"><img src="https://zenodo.org/badge/DOI/10.5281/zenodo.1043259.svg" alt="DOI"></a>

Image URL 

https://zenodo.org/badge/DOI/10.5281/zenodo.1043259.svg

Target URL 

https://doi.org/10.5281/zenodo.1043259

Grants:
European Commission:
  • MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
Meeting:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, Japan, 16 May - 18 May 2017
Communities:
License (for files):
Creative Commons Attribution Non Commercial 4.0 International

Versions

Version 1 10.5281/zenodo.1043259 May 16, 2017
Cite all versions? You can cite all versions by using the DOI 10.5281/zenodo.1043258. This DOI represents all versions, and will always resolve to the latest one. Read more.

Share

Cite as

Export