May 16, 2017 Conference paper Open Access

Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny

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  <identifier identifierType="DOI">10.5281/zenodo.1043259</identifier>
  <creators>
    <creator>
      <creatorName>Dempwolf, Sophia</creatorName>
      <givenName>Sophia</givenName>
      <familyName>Dempwolf</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH</affiliation>
    </creator>
    <creator>
      <creatorName>Hofmann, Lutz</creatorName>
      <givenName>Lutz</givenName>
      <familyName>Hofmann</familyName>
      <affiliation>Fraunhofer Institute for Electronic Nano Systems</affiliation>
    </creator>
    <creator>
      <creatorName>Bowers, Christopher</creatorName>
      <givenName>Christopher</givenName>
      <familyName>Bowers</familyName>
      <affiliation>X-Celeprint Inc.</affiliation>
    </creator>
    <creator>
      <creatorName>Guenther, Daniela</creatorName>
      <givenName>Daniela</givenName>
      <familyName>Guenther</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH</affiliation>
    </creator>
    <creator>
      <creatorName>Knechtel, Roy</creatorName>
      <givenName>Roy</givenName>
      <familyName>Knechtel</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH</affiliation>
    </creator>
    <creator>
      <creatorName>Schulz, Stefan E.</creatorName>
      <givenName>Stefan E.</givenName>
      <familyName>Schulz</familyName>
      <affiliation>Fraunhofer Institute for Electronic Nano Systems</affiliation>
    </creator>
    <creator>
      <creatorName>Gerbach, Ronny</creatorName>
      <givenName>Ronny</givenName>
      <familyName>Gerbach</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH</affiliation>
    </creator>
  </creators>
  <titles>
    <title>Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2017</publicationYear>
  <dates>
    <date dateType="Issued">2017-05-16</date>
  </dates>
  <resourceType resourceTypeGeneral="ConferencePaper"/>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/1043259</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsVersionOf">10.5281/zenodo.1043258</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/microprince</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by-nc/4.0/legalcode">Creative Commons Attribution Non Commercial 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/100010661</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/737465/">737465</awardNumber>
      <awardTitle>Pilot line for micro-transfer-printing of functional components on wafer level</awardTitle>
    </fundingReference>
  </fundingReferences>
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