Conference paper Open Access
Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny
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{
"publisher": "Zenodo",
"DOI": "10.5281/zenodo.1043259",
"title": "Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors",
"issued": {
"date-parts": [
[
2017,
5,
16
]
]
},
"abstract": "<p>This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.</p>",
"author": [
{
"family": "Dempwolf, Sophia"
},
{
"family": "Hofmann, Lutz"
},
{
"family": "Bowers, Christopher"
},
{
"family": "Guenther, Daniela"
},
{
"family": "Knechtel, Roy"
},
{
"family": "Schulz, Stefan E."
},
{
"family": "Gerbach, Ronny"
}
],
"id": "1043259",
"event-place": "Tokyo, Japan",
"type": "paper-conference",
"event": "2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)"
}
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| All versions | This version | |
|---|---|---|
| Views | 194 | 195 |
| Downloads | 230 | 229 |
| Data volume | 43.1 MB | 42.9 MB |
| Unique views | 185 | 186 |
| Unique downloads | 218 | 217 |
Indexed in
- Publication date:
- May 16, 2017
- DOI:
-
- Grants:
-
European Commission:
- MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
- Meeting:
- 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, Japan, 16 May - 18 May 2017
- Communities:
- License (for files):
- Creative Commons Attribution Non Commercial 4.0 International