Published October 8, 2017 | Version v1
Conference paper Open

A Direct Carrier I/Q Modulator for High-Speed Communication at D-Band Using 130 nm SiGe BiCMOS Technology

  • 1. Chalmers University of Technology

Description

This paper presents a 110-170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS technology with ft/fmax values of 250 GHz/ 370 GHz. The design is based on double-balanced Gilbert mixer cells with on-chip quadrature LO phase shifter and RF balun. In single-sideband operation, the modulator exhibits up to 9.5 dB conversion gain and has measured 3 dB IF bandwidth of 12 GHz. The measured image rejection ratio and LO to RF isolation are as high as 20 dB and 31 dB respectively. Meas-ured input P1dB is -17 dBm at 127 GHz output. The DC power con-sumption is 53 mW. The active chip area is 620 μm× 480 μm in-cluding the RF and LO baluns. The circuit is capable of transmit-ting more than 12 Gbit/s QPSK signal.
 

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Funding

M3TERA – Micromachined terahertz systems -a new heterogeneous integration platform enabling the commercialization of the THz frequency spectrum 644039
European Commission