2024-03-28T16:59:15Z
https://zenodo.org/oai2d
oai:zenodo.org:1117748
2020-01-20T17:29:29Z
user-m3tera
user-eu
Hassona, Ahmed
Vassilev, Vessen
He, Zhongxia Simon
Mariotti, Chiara
Dielacher, Franz
Zirath, Herbert
2017-12-18
<p>This paper presents a novel interconnect for coupling Millimeter-wave (mmW) signals from integrated circuits to air-filled waveguides. The proposed solution is realized through a slot antenna implemetend in embedded Wafer Level Ball Grid Array (eWLB) process. The antenna radiates into a high-resistivity (HR) silicon taper perpendicular to its plane, which in turn radiates into an air-filled waveguide. The interconnect achieves a measured average insertion loss of 3.4 dB over the frequency range 166-151 GHz. The proposed interconnect is generic and does not require any galvanic contacts. The utilized eWLB packaging process is suitable for low-cost high-volume productionand allows heterogeneous integration with other technologies. This work proposes a straightforward cost-effective high-performance interconnect for mmW integration and thus addressing one of the main challenges facing systems operating beyond 100 GHz.</p>
https://doi.org/10.5281/zenodo.1117748
oai:zenodo.org:1117748
https://doi.org/10.1109/LMWC.2017.2763118
eng
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1117747
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
IEEE Microwave and Wireless Components Letters, (2017-12-18)
D-band
interconnects
waveguide
transition
taper
eWLB
millimeter waves
THz
Silicon Taper Based D-band Chip to Waveguide Interconnect for Millimeter-wave Systems
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:1041325
2020-01-20T17:28:21Z
user-m3tera
user-eu
Bao, Mingquan
He, Zhongxia Simon
Zirath, Herbert
2017-10-08
<p>A 6-stage, 8-way combining power amplifier (PA) in a 130 nm SiGe BiCMOS technology is designed and measured. This PA has an output power of 12.5 – 15.5 dBm in a frequency range from 100 GHz to 145 GHz, when the input power is about 2 dBm. The small signal gain is 19 dB and the maximum DC power consumption is 480 mW with a supply voltage of 1.87 V. The peak power added efficiency (PAE) is 6.4% in D-band. T-junctions are utilized to combine and divide millimeter-wave power. To reduce the PA’s loss and chip area, neither a Wilkinson power combiner/divider nor a balun is applied. The chip size is 0.53 mm2.</p>
https://doi.org/10.5281/zenodo.1041325
oai:zenodo.org:1041325
eng
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1041324
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2017, European Micrwave Week 2017, Nürnberg/Germany, 8-13 October 2017
D-band
Power amplifier
SiGe
BiCMOS
A 100-145 GHz Area-Efficient Power Amplifier in a 130 nm SiGe Technology
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:895937
2020-01-20T16:45:28Z
user-m3tera
openaire
user-eu
I. Maestrojuán
M. Goñi
A. Martínez
2017-08-27
<p>Nowadays, an important increased in the necessity of high data rate links in the telecommunication field has made of THz technology an attractive solution for these kind of applications. This is the main motivation for M3tera H2020 project, developing a revolutionary platform for enabling volume-manufacturable, cost-efficiency, highly integrated terahertz systems mainly focused on high-speed telecommunication links for small-cloudnetworks.</p>
https://doi.org/10.5281/zenodo.895937
oai:zenodo.org:895937
Zenodo
https://doi.org/10.5281/zenodo.895960
https://doi.org/10.5281/zenodo.895925
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.895936
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial 4.0 International
https://creativecommons.org/licenses/by-nc/4.0/legalcode
IRMMW-THz 2017 conference, Cancun/Mexiko, 27th August to 1st September
THz technology
telecommunication
reflector antenna
High Gain Antenna for M3tera H2020 project
info:eu-repo/semantics/conferencePoster
oai:zenodo.org:1462754
2020-01-24T19:23:43Z
user-m3tera
openaire_data
user-eu
Campion, James
Glubokov, Oleksandr KTH
Gomez, Adrían
Krivovitca, Aleksandr
Shah, Umer
Bolander, Lars
Li, Yinggang
Oberhammer, Joachim
2018-10-15
<p>The dataset contains S-parameter measurements between 110-170 GHz, for a silicon micromachined filter. It also contains quality factor data for the filter and the complex propagation constant data.</p>
https://doi.org/10.5281/zenodo.1462754
oai:zenodo.org:1462754
eng
Zenodo
https://doi.org/10.1109/MWSYM.2018.8439601
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1462753
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
IMS 2018, International Microwave Symposium 2018, Philadelphia, USA, 10-15 June 2018
An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications
info:eu-repo/semantics/other
oai:zenodo.org:580054
2020-01-24T19:23:19Z
user-m3tera
openaire_data
user-eu
Vorobyov, A.
Farserotu, J.
Decotignie, J-D.
2017-04-06
<p>This is the dataset related to the paper "3D Printed Antenass for mm-Wave Sensing Applications":</p>
<p>This paper presents three low cost 3D printed antenna concepts for integration with a miniature mm-wave platform. The proposed solutions are optimized to operate in mm-wave ISM band (122GHz-123GHz). Different, inexpensive, detachable antennas can be used with the same platform for various RF sensing applications such as food safety, health and industrial.</p>
https://doi.org/10.5281/zenodo.580054
oai:zenodo.org:580054
Zenodo
https://doi.org/10.5281/zenodo.575878
https://doi.org/10.1109/ISMICT.2017.7891759
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
3D printing, lens antenna, RF sensing
3D Printed Antennas for mm-Wave Sensing Applicatins: Dataset
info:eu-repo/semantics/other
oai:zenodo.org:2267907
2020-01-20T16:43:51Z
user-m3tera
user-eu
Seyedhosseinzadeh, Neda
Nabavi, Abdolreza
Carpenter, Sona
He, Zhongxia Simon
Bao, Mingquan
Zirath, Herbert
2017-10-08
<p>This paper demonstrates a wideband, subharmonic down converting mixer using a commercial 130-nm SiGe-BiCMOS technology. The mixer adopts a frequency doubling LO-stage, a differential switched-transconductance RFstage, on-chip LO and RF baluns, and two emitter-follower buffer-stages. The measured results exhibit a maximum conversion gain up to 2.6 dB over the frequency range of 100 to 140 GHz with a LO power of 5 dBm. The mixer achieves an input referred 1-dB compression point of -7.2 dBm, with a DC<br>
power of 46.3 mW, including 26.7 mW for buffer-stages. It demonstrates also up to 12 GHz 3-dB IF bandwidth, which to the authors’ best knowledge, is the highest obtained among active sub-harmonic mixers operating above 100 GHz. The chip occupies 0.4 mm2, including pads.</p>
https://doi.org/10.5281/zenodo.2267907
oai:zenodo.org:2267907
eng
Zenodo
https://doi.org/10.5281/zenodo.1486681
https://doi.org/10.5281/zenodo.1041333
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1041332
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2017, European Microwave Week 2017, Nürnberg/Germany, 8-13 October 2017
SiGe MMICs
millimeter-wave
subharmonic mixer (SHM)
conversion gain
A 100-140 GHz SiGe-BiCMOS Sub-Harmonic Down-Converter Mixer
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:400150
2020-01-20T14:45:17Z
user-m3tera
user-eu
A. Martìnez
I. Maestrojuan
D. Valcazar
J. Teniente
2017-03-16
<p> </p>
<p><strong>Nowadays the increase of high data rate communication applications requires high bandwidth at sub-millimeter wave frequencies and above, therefore high performance antennas are needed. This paper presents the design, fabrication and test of a high gain offset parabolic reflector antenna at sub-millimeter wave frequencies using typical machining techniques. The high gain antenna is focused on a 330 GHz communication link test with up to 60 GHz bandwidth with the goal to set up a 50 Gbit/s data rate link, over 100 m distance. </strong></p>
https://doi.org/10.5281/zenodo.400150
oai:zenodo.org:400150
Zenodo
https://doi.org/10.5281/zenodo.400151
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2016, European Microwave Week 2016, London, 3-7 October 2016
parabolic antenna, antenna, communication, measurements
High Gain Antenna for Sub-Milimeter Wave Communications
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:1462691
2020-01-20T17:38:02Z
user-m3tera
user-eu
Campion, James
Glubokov, Oleksandr
Gomez, Adrían
Krivovitca, Aleksandr
Shah, Umer
Bolander, Lars
Li, Yinggang
Oberhammer, Joachim
2018-10-15
<p>A very low-loss micromachined waveguide bandpass filter for use in D-band (110–170GHz) telecommunication applications is presented. The 134–146GHz filter is implemented in a silicon micromachined technology which utilises a double <br>
H-plane split, resulting in significantly lower insertion loss than conventional micromachined waveguide devices. Custom splitblocks<br>
are designed and implemented to interface with the micromachined component. Compact micromachined E-plane bends connect the split-blocks and DUT. The measured insertion loss per unit length of the waveguide technology (0:008–0:016dB=mm) is the lowest reported to date for any micromachined waveguide at D-band. The fabricated 6-pole filter, with a bandwidth of 11:8GHz (8:4%), has a minimum insertion loss of 0:41dB, averaging 0:5dB across its 1dB bandwidth, making it the lowest-loss D-band filter reported to date in any technology. Its return loss is better than 20dB across 85% of the same bandwidth. The unloaded quality factor of a single cavity resonator implemented in this technology is estimated to be 1600.</p>
https://doi.org/10.1109/MWSYM.2018.8439601
oai:zenodo.org:1462691
eng
Zenodo
https://doi.org/10.5281/zenodo.1462754
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
IMS 2018, International Microwave Symposium 2018, Philadelphia, USA, 10-15 June 2018
D-band
bandpass filter
micromachined waveguide
waveguide filter
wireless link
telecommunication
An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications
info:eu-repo/semantics/preprint
oai:zenodo.org:815940
2020-01-20T17:17:21Z
user-m3tera
user-eu
Campion, James
Shah, Umer
Oberhammer, Joachim
2017-06-04
<p>Current waveguide flange standards do not allow for the accurate fitting of microchips, due to the large mechanical tolerances of the flange alignment pins and the brittle nature of Silicon, requiring greatly oversized alignment holes on the chip to fit worst-case fabrication tolerances, resulting in unacceptably large misalignment error for sub-THz frequencies. This paper presents, for the first time, a new method for directly aligning micromachined Silicon chips to standard, i.e. unmodified, waveguide<br>
flanges with alignment accuracy significantly better than the waveguide-flange fabrication tolerances, through the combination<br>
of a tightly-fitting circular and an elliptical alignment hole on the chip. A Monte Carlo analysis predicts the reduction of the<br>
mechanical assembly margin by a factor of 5.5 compared to conventional circular holes, reducing the potential chip misalignment<br>
from 46 μm to 8.5 μm for a probability of fitting of 99.5%. For experimental verification, micromachined waveguide chips using either conventional (oversized) circular or the proposed elliptical alignment holes were fabricated and measured. A reduction<br>
in the standard deviation of the reflection coefficient by a factor of up to 20 was experimentally observed from a total of<br>
200 measurements with random chip placement, exceeding the expectations from the Monte Carlo analysis. To our knowledge,<br>
this paper presents the first solution for highly accurate assembly of micromachined waveguide chips to standard waveguide flanges, requiring no custom flanges or other tailor-made split blocks.<br>
</p>
https://doi.org/10.5281/zenodo.815940
oai:zenodo.org:815940
Zenodo
https://doi.org/10.5281/zenodo.896233
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.815939
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial Share Alike 4.0 International
https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode
IMS 2017, International Microwave Symposium 2017, Honolulu/Hawaii, 4th - 9th July 201
alignment
micromachining
waveguide flange
submillimeter-wave
calibration
Elliptical Alignment Holes Enabling Accurate Direct Assembly of Microchips to Standard Waveguide Flanges at sub-THz Frequencies
info:eu-repo/semantics/preprint
oai:zenodo.org:815930
2020-01-20T14:56:06Z
user-m3tera
user-eu
Ahmed Hassona
Zhongxia Simon He
Chiara Mariotti
Franz Dielacher
Vessen Vassilev
Yinggang Li
Joachim Oberhammer
Herbert Zirath
2017-06-04
<p>This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Ball Grid Array (eWLB) commercial process. The transition is realized through a patch slot antenna directly radiating to a standard waveguide opening. The interconnect achieves low insertion loss and good bandwidth. The measured minimum Insertion Loss (IL) is 2 dB and the average is 3 dB across a bandwidth of 22% covering the frequency range 110-138 GHz. In addition, the structure is easy to integrate as it does not require any special assembly nor any galvanic contacts. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz.</p>
https://doi.org/10.5281/zenodo.815930
oai:zenodo.org:815930
Zenodo
https://doi.org/10.5281/zenodo.822283
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.815929
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial Share Alike 4.0 International
https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode
IMS 2017, International Microwave Symposium 2017, Honolulu/Hawai, 4th - 9th of June 2017
D-band
interconnects
waveguide transition
eWLB
millimeter waves
THz
A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology
info:eu-repo/semantics/preprint
oai:zenodo.org:154031
2020-01-20T15:50:40Z
user-m3tera
user-eu
Vorobyov, A.
Daskalaki, E.
Hennemann, C.
Decotignie, J.D.
2016-03-14
<p>The skin response to high radio frequency has been associated with the human physical condition and most prominently with the stress. The objective of this study is to investigate the possibility to detect mental and light physical stress through the measurement of skin reflectance in the mmwave/sub-THz band. Two frequency bands have been considered, 75-110 GHz (Band-I) and 325-500 GHz (Band-II), while the measurements have been performed in the three different locations, the arm, the dorsal side of the hand and the fingertip. The measurement setup is discussed in detail and the reflectance spectrum is demonstrated. The results illustrate a difference in skin reflectance under rest and stress in Band-II which ranges from 3.5 dB at the finger to 7 dB at the hand. The outcomes of this study indicate the feasibility of stress detection through skin reflectance measurement and serve as a suggestion<br>
for deeper exploration of higher frequency bands.</p>
https://doi.org/10.5281/zenodo.154031
oai:zenodo.org:154031
IEEE
https://doi.org/10.5281/zenodo.154032
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial No Derivatives 4.0 International
https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode
Proceedings of 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, (2016-03-14)
EMBC, 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Orlando, Florida, 16-20 August 2016
RF sensing
mmwave
skin reflectance
THz
Human Physical Condition RF Sensing at THz range
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:822283
2020-01-24T19:25:23Z
user-m3tera
openaire_data
user-eu
Hassona,Ahmed
He, Zhongxia Simon
Mariotti, Chiara
Dielacher, Franz
Vassilev, Vessen
Li, Yinggang
Oberhammer, Joachim
Zirath, Herbert
2017-06-04
<p>This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Ball Grid Array (eWLB) commercial process. The transition is realized through a patch slot antenna directly radiating to a standard waveguide opening. The interconnect achieves low insertion loss and good bandwidth. The measured minimum Insertion Loss (IL) is 2 dB and the average is 3 dB across a bandwidth of 22% covering the frequency range 110-138 GHz. In addition, the structure is easy to integrate as it does not require any special assembly nor any galvanic contacts. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz.</p>
https://doi.org/10.5281/zenodo.822283
oai:zenodo.org:822283
Zenodo
https://doi.org/10.5281/zenodo.815930
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.822282
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial Share Alike 4.0 International
https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode
IMS2017, International Microwave Symposium 2017 (IMS 2017), Honolulu/Hawai, 4th to 9th of June 2017
D-band
interconnects
waveguide transition,
eWLB
millimeter waves
A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology-dataset
info:eu-repo/semantics/other
oai:zenodo.org:2415639
2020-01-24T19:23:17Z
user-m3tera
openaire_data
user-eu
Vorobyov, Alexander
Daskalaki, Eleni
Farserotu, John
2018-12-19
<p>Expected Rx power over distance for human target sitting in front of the radar.</p>
<p>Expected Rx power difference over distance for human target sitting in front oft he radar due to HR and BR.</p>
https://doi.org/10.5281/zenodo.2415639
oai:zenodo.org:2415639
Zenodo
https://doi.org/10.5281/zenodo.1244160
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.2415638
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
Simulated received power vs distance
info:eu-repo/semantics/other
oai:zenodo.org:1041331
2020-01-20T17:20:34Z
user-m3tera
user-eu
Carpenter, Sona
He, Zhongxia Simon
Zirath, Herbert
2017-10-08
<p>This paper presents a 110-170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS technology with ft/fmax values of 250 GHz/ 370 GHz. The design is based on double-balanced Gilbert mixer cells with on-chip quadrature LO phase shifter and RF balun. In single-sideband operation, the modulator exhibits up to 9.5 dB conversion gain and has measured 3 dB IF bandwidth of 12 GHz. The measured image rejection ratio and LO to RF isolation are as high as 20 dB and 31 dB respectively. Meas-ured input P1dB is -17 dBm at 127 GHz output. The DC power con-sumption is 53 mW. The active chip area is 620 μm× 480 μm in-cluding the RF and LO baluns. The circuit is capable of transmit-ting more than 12 Gbit/s QPSK signal.<br>
</p>
https://doi.org/10.5281/zenodo.1041331
oai:zenodo.org:1041331
eng
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1041330
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2017, European Microwave Week 2017, Nürnberg/Germany, 8-13 October 2017
Gilbert cell mixer
millimeter wave
5G
I/Q modulator
SiGe BiCMOS
D-band
A Direct Carrier I/Q Modulator for High-Speed Communication at D-Band Using 130 nm SiGe BiCMOS Technology
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:895925
2020-01-20T14:23:19Z
user-m3tera
user-eu
I. Maestrojuan
M. Goñi
A. Martinez
2017-08-27
<p>The following paper presents design and fabrication process of a high gain reflector antenna system carried out within the H2020 M3tera project. This project is focused on the development of a complete microsystem able to work as high rate communication link at D-Band frequencies. The paper presents design and fabrication aspects of two prototypes one fabricated by conventional techniques and the second one by 3D printing. Comparative performance will be presented at the conference.</p>
https://doi.org/10.5281/zenodo.895925
oai:zenodo.org:895925
Zenodo
https://doi.org/10.5281/zenodo.895960
https://doi.org/10.5281/zenodo.895937
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.895924
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial 4.0 International
https://creativecommons.org/licenses/by-nc/4.0/legalcode
IRMMW-THz 2017 conference, Cancun/Mexiko, 27th August to 1st September
reflector antenna
D-Band frequency
telecommunication
3D printing
High Gain Reflector Antenna for M3tera H2020 Project
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:1244160
2020-01-20T17:30:58Z
user-m3tera
user-eu
Vorobyov, Alexander
Daskalaki, Eleni
Farserotu, John
2018-04-24
<p>Remote monitoring of vital signs (VS) is an emerging technology with a vast number of possible uses from hospital care to the automotive industry and assisting living environments. Radio-frequency (RF) sensing enables the remote and unobtrusive measurement of VS without the need to wear any special device or clothing and under any lighting conditions. A demonstrator of RF vital signs sensing was designed and prototyped based on a continuous wave reflectometer involving a Software Defined Radio platform. The sensor operates at 110 GHz. The feasibility of remote respiration and heart rate (HR) monitoring was investigated. The breathing pattern was found to affect significantly the reliability of the HR estimation. The potential of remote VS sensing at distances up to 10 m was theoretically explored.</p>
https://doi.org/10.5281/zenodo.1244160
oai:zenodo.org:1244160
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1244159
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial No Derivatives 4.0 International
https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode
ELNANO-2018, IEEE 38th International Conference on ELECTRONICS AND NANOTECHNOLOGY, Kyiv, Ukraine, 24-26 April, 2018
RF sensing
antenna
mm-wave
reflectometer
Feasibility of Remote Vital Signs Sensing with a mm-Wave CW Reflectometer
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:154032
2020-01-24T19:24:50Z
user-m3tera
openaire_data
user-eu
Vorobyov, A.
Daskalaki, E.
Hennemann, C.
Decotignie, J.-D.
2016-09-14
<p>The objective of this study is to investigate the possibility to detect mental and light physical stress through the measurement of skin reflectance in the mm-wave/sub-THz band. Two frequency bands have been considered, 75-110 GHz (Band-I) and 325-500 GHz (Band-II), while the measurements have been performed in the three different locations, the arm, the dorsal side of the hand and the fingertip.</p>
<p>Each transmitter and receiver set is equipped with a matched standard horn antenna operated at the selected frequency band.</p>
<p>The transmitter and receiver used during the test are active mixers. To operate each active module a local oscillator (LO) is required. The PXA and the Agilent generators are used as LO for transmitter (TX) and receiver (RX) accordingly (Fig. 2). The output signal from the receiver (RX) is gathered by a spectrum analyzer and then post-processed. The entire lab bench is connected through GPIB and both LO generators are synchronized (10MHz).</p>
<p>The measured reflected signal amplitude is recorded and post-process on a personal computer.</p>
<p>The dataset refers to Laboratory test. The skin reflectance was measured during rest and after mental and physical stress. Physical stress was provoked using a dynamometer under 15 N of force for 5 minutes. Provocation of mental stress was achieved with the use of the Stroop Test [11] for 15 minutes. A stress measurement was always preceded by a resting period of at least 15 minutes. Three hand locations have been considered, (a) arm, (b) hand and (c) finger.</p>
<p>The datasets are related to the open accessible publication "<strong>Human Physical Condition RF Sensing at THz range".</strong></p>
https://doi.org/10.5281/zenodo.154032
oai:zenodo.org:154032
Zenodo
https://doi.org/10.5281/zenodo.154031
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial No Derivatives 4.0 International
https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode
EMBC, 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Orlando, Florida, 16-20 August 2016
RF sensing
THz
mm-wave
Skin response measurements
info:eu-repo/semantics/other
oai:zenodo.org:895960
2020-01-24T19:24:03Z
user-m3tera
openaire_data
user-eu
I. Maestrojuan
M. Goñi
A. Martinez
2017-08-27
<p>The following paper presents design and fabrication process of a high gain reflector antenna system carried out within the H2020 M3tera project. This project is focused on the development of a complete microsystem able to work as high rate communication link at D-Band frequencies. The paper presents design and fabrication aspects of two prototypes one fabricated by conventional techniques and the second one by 3D printing. Comparative performance will be presented at the conference</p>
https://doi.org/10.5281/zenodo.895960
oai:zenodo.org:895960
Zenodo
https://doi.org/10.5281/zenodo.895925
https://doi.org/10.5281/zenodo.895937
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.895959
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial 4.0 International
https://creativecommons.org/licenses/by-nc/4.0/legalcode
3D printing
D-Band frequencies
telecommunication
High Gain Reflector Antenna for M3tera H2020 Project - Dataset
info:eu-repo/semantics/other
oai:zenodo.org:575878
2020-01-20T17:40:35Z
user-m3tera
user-eu
Vorobyov, A.
Farserotu, J. R.
Decotignie, J.-D.
2017-02-06
<p>This paper presents three low cost 3D printed antenna concepts for integration with a miniature mm-wave platform. The proposed solutions are optimized to operate in mm-wave ISM band (122GHz-123GHz). Different, inexpensive, detachable antennas can be used with the same platform for various RF sensing applications such as food safety, health and industrial.</p>
https://doi.org/10.5281/zenodo.575878
oai:zenodo.org:575878
Zenodo
https://doi.org/10.1109/ISMICT.2017.7891759
https://doi.org/10.5281/zenodo.580054
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
3D printing
lens antennna
RF sensing
3D Printed Antennas for Mm-wave Sensing Applications
info:eu-repo/semantics/article
oai:zenodo.org:2637687
2020-01-20T17:37:53Z
user-m3tera
user-car2tera-h2020
openaire
user-eu
Yinggang Li
Joachim Oberhammer
2019-04-12
<p>For<strong> the 2nd Towards THz Communications Workshop</strong> held on 7th March 2019 at the Albert Borschette Congress Centre <strong>(CCAB)</strong> in Brussels, Prof. Joachim Oberhammer (KTH) contributed to the event with the topic of <strong>THz micromachining – enabling the large-scale exploitation of the THz frequency spectrum </strong>and Dr. Yinggang Li (EAB) had contribution with the topic of <strong>Point-to-point wireless links toward to sub-millimeter wave</strong>. They were the representatives of the Car2TERA project and shared that the workshop was completed succesfully.</p>
<p>The event was dynamic, several topics were discussed and divided into one plenary session and 3 main sessions:</p>
<ul>
<li>Session 1: THz Communication Electronic and Photonic Components and Systems</li>
<li>Session 2: THz Communication Networks, Protocols and Architectures and User Cases</li>
<li>Session 3: THz Communication Spectrum and Physical Layer</li>
</ul>
<p>From the Car2TERA project consortium, Prof. Joachim Oberhammer (KTH) contributed to Session 1 with the topic of <strong>THz micromachining – enabling the large-scale exploitation of the THz frequency spectrum </strong>and Dr. Yinggang Li (EAB) had contribution in Session 2 with the topic of <strong>Point-to-point wireless links toward to sub-millimeter wave</strong>.</p>
<p>The 2nd workshop gathered together key performers currently working on, or having interest, in THz communications in order to explore future R&I plans for the future and provided input to EC for future calls.</p>
https://doi.org/10.5281/zenodo.2637687
oai:zenodo.org:2637687
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/car2tera-h2020
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.2637686
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
2nd Towards THz Communications Workshop, Berlin, Germany, 7th March 2019
THz micromachining systems
MEMS
sub-THz waveguide
car radar
sub-THz filters
THz micromachining – enabling the large-scale exploitation of the THz frequency spectrum?
info:eu-repo/semantics/lecture
oai:zenodo.org:896233
2020-01-24T19:24:50Z
user-m3tera
openaire_data
user-eu
James Campion
Umer Shah
Joachim Oberhammer
2017-06-04
<p>Current waveguide flange standards do not allow for the accurate fitting of microchips, due to the large mechanical tolerances of the flange alignment pins and the brittle nature of Silicon, requiring greatly oversized alignment holes on the chip to fit worst-case fabrication tolerances, resulting in unacceptably large misalignment error for sub-THz frequencies. This paper presents, for the first time, a new method for directly aligning micromachined Silicon chips to standard, i.e. unmodified, waveguide flanges with alignment accuracy significantly better than the waveguide-flange fabrication tolerances, through the combination of a tightly-fitting circular and an elliptical alignment hole on the chip. A Monte Carlo analysis predicts the reduction of the mechanical assembly margin by a factor of 5.5 compared to conventional circular holes, reducing the potential chip misalignment from 46 μm to 8.5 μm for a probability of fitting of 99.5%. For experimental verification, micromachined waveguide chips using either conventional (oversized) circular or the proposed elliptical alignment holes were fabricated and measured. A reduction in the standard deviation of the reflection coefficient by a factor of up to 20 was experimentally observed from a total of 200 measurements with random chip placement, exceeding the<br>
expectations from the Monte Carlo analysis. To our knowledge, this paper presents the first solution for highly accurate assembly<br>
of micromachined waveguide chips to standard waveguide flanges, requiring no custom flanges or other tailor-made split blocks.<br>
</p>
https://doi.org/10.5281/zenodo.896233
oai:zenodo.org:896233
Zenodo
https://doi.org/10.5281/zenodo.815940
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.896232
info:eu-repo/semantics/openAccess
Creative Commons Attribution Non Commercial 4.0 International
https://creativecommons.org/licenses/by-nc/4.0/legalcode
International Microwave Symposium 2017 (IMS 2017), Honolulu/Hawaii, 4th - 9th July 2017
alginment
micromachining
waveguide flange
submillimeter-wave
calibration
Elliptical Alignment Holes Enabling Accurate Direct Assembly of Microchips to Standard Waveguide Flanges at sub-THz Frequencies - Dataset
info:eu-repo/semantics/other
oai:zenodo.org:400151
2020-01-20T14:39:37Z
user-m3tera
openaire
user-eu
A. Martìnez
2017-03-16
<p>Outline of the presentation:</p>
<p> </p>
<p> </p>
<p><strong>1.Motivation </strong></p>
<p>2.Anteral’s contribution to mmW and THz systems</p>
<p>3.mmW and THz communication systems</p>
<p>4.High gain antennas for communications</p>
<p>5.Success story</p>
<p> - 330 GHz parabolic offset reflector antenna.</p>
<p>6.Under development:</p>
<p> - D-band parabolic offset reflector antenna [M3tera project. H2020]</p>
<p>7.Conclusions</p>
https://doi.org/10.5281/zenodo.400151
oai:zenodo.org:400151
Zenodo
https://doi.org/10.5281/zenodo.400150
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2016, European Microwave Week 2016, London, 3-7 October 2016
parabolic antenna, antenna, communication, measurements
High Gain Antenna for Millimetre-Wave Communications
info:eu-repo/semantics/lecture
oai:zenodo.org:1486681
2020-01-20T16:44:08Z
user-m3tera
user-eu
Seyedhosseinzadeh, Neda
Nabavi, Abdolreza
Carpenter, Sona
He, Zhongxia Simon
Bao, Mingquan
Zirath, Herbert
2017-10-08
<p>This paper demonstrates a wideband, subharmonic down converting mixer using a commercial 130-nm SiGe-BiCMOS technology. The mixer adopts a frequency doubling LO-stage, a differential switched-transconductance RFstage, on-chip LO and RF baluns, and two emitter-follower buffer-stages. The measured results exhibit a maximum conversion gain up to 2.6 dB over the frequency range of 100 to 140 GHz with a LO power of 5 dBm. The mixer achieves an input referred 1-dB compression point of -7.2 dBm, with a DC<br>
power of 46.3 mW, including 26.7 mW for buffer-stages. It demonstrates also up to 12 GHz 3-dB IF bandwidth, which to the authors’ best knowledge, is the highest obtained among active sub-harmonic mixers operating above 100 GHz. The chip occupies 0.4 mm2, including pads.</p>
https://doi.org/10.5281/zenodo.1486681
oai:zenodo.org:1486681
eng
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1041332
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2017, European Microwave Week 2017, Nürnberg/Germany, 8-13 October 2017
SiGe MMICs
millimeter-wave
subharmonic mixer (SHM)
conversion gain
A 100-140 GHz SiGe-BiCMOS Sub-Harmonic Down-Converter Mixer
info:eu-repo/semantics/conferencePaper
oai:zenodo.org:1041333
2020-01-20T16:41:12Z
user-m3tera
user-eu
Seyedhosseinzadeh, Neda
Nabavi, Abdolreza
Carpenter, Sona
He, Zhongxia Simon
Bao, Mingquan
Zirath, Herbert
2017-10-08
<p>A compact, broadband, high gain, second-order active down-converter subharmonic mixer is demonstrated using a 130-nm SiGe BiCMOS technology. The mixer adopts a bottom-LO Gilbert topology, on-chip RF and LO baluns and two emitter-follower buffers to realize a high gain wideband operation in both RF and IF frequencies. The measured performance exhibits a flat conversion gain (CG) of about 11 dB from 90 to 130 GHz with an average LO power of +3 dBm and high 2LO-RF isolation better than 60 dB. The mixer shows an input 1-dB compression point of -16 dBm consuming a dc power of only 40 mW. The chip dimension is 0.4 mm2, including probing pads. It demonstrates also up to 12 GHz 3-dB IF bandwidth, which to the authors’ knowledge, is the highest obtained among active mixers operating above 100 GHz</p>
https://doi.org/10.5281/zenodo.1041333
oai:zenodo.org:1041333
eng
Zenodo
https://zenodo.org/communities/m3tera
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.1041332
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
EuMW 2017, European Microwave Week 2017, Nürnberg/Germany, 8-13 October 2017
SiGe MMICs
millimeter-wave
subharmonic mixer (SHM)
conversion gain
A SiGe High Gain and Highly Linear F-Band Single-Balanced Subharmonic Mixer
info:eu-repo/semantics/conferencePaper